Micro- and Nanostructure Technology and Microoptics Technology

Micro- and nanostructure technology

• Photolithography
• Electron Beam Lithography System SB350ƒOS
• 300ƒmm writing capability
• Minimum feature size < 65 ƒnm
• Address grid 1ƒ nm
• Placement accuracy < 15 nm
• Advanced multilevel technology
• Efficient data processing capability
• Dynamic LED-based grayscale lithography system "High Five"
• Lithography system specially designed for generation of micro optical elements
• High dynamic dosage control at 405 nm exposure wavelength
• Small feature sizes down to 0.5 µm
• Maximum writing field size: 0.5 × 0.5 m²

Microoptics technology

• Planarization / ion beam figuring of substrates
• Resist technology for 12” substrates
• Reactive ion etching

• Silicon, fused silica, high index materials
• Etching aspect ratio < 1:10

• Coating

• HR, AR, metals
• Sputtering, evaporation, ALD

• Wafer dicing and ultra precision machining
• UV-moulding
• Hot embossing facility
• Mask-aligner

• Nano imprint and wafer scale replication