Hybrid Integration

Lithography, dry etching as well as UV molding are characterized by good lateral precision. So the pitch of a lens array can be matched to that of another or to arrays of fibers, detectors, or lasers being a prerequisite for thhe generation of microoptical systems.

Furthermore, an integration on wafer scale becomes feasible

 

Typical examples are the following

  • UV molding on top of a wafer carrying detectors or VCSELs
  • Multifunctional elements fabricated by combination of technologies
  • Double sided UV molding in a mask aligner
  • Double sided elements fabricated by dry etching
  • Surface coating; this involves anti-reflection coatings, but also the integration of filters, beam splitters etc.
  • Generation of electrode patterns
  • Integration of apertures made with metal as well as with black polymer

As the last process step the wafer can be separated into a high number of micro-optical (sub-)systems.