Micro-Assembly and System Integration

The Fraunhofer IOF possesses extensive expertise in the development of technologies for the hybrid integration of diverse components with high precision for the construction of complex opto-mechanical and opto-electronic micro- and macrosystems. This encompasses assembly technologies (positioning, aligning), joining technologies (bonding, laser soldering, plasma bonding, laser splicing, alignment turning) and the integration of optical systems for space applications.

 

Bonding technologies

The bonding technologies used in microassembly influence the accuracy of the positioned component as well as the longterm- and temperature stability...
 

Hybrid integration

Lithography, dry etching as well as UV molding are characterized by good lateral precision. So the pitch of a lens array can be matched to that of another...
 

Microassembly and packaging technologies for microoptical systems

Miniaturized optical systems more and more feature not only optical components but also electronics and micromechanical actuators to build high functional...
 

Handling, positioning, alignment

For a mechanized or automated micro assembly one fundamental requirement is the development of handling procedures that are not only suitable...
 

Wafer-level-optics

Micro-optical imaging systems differ from conventional camera set-up in the degree of their miniaturization and consequently their production technologies...
 

System integration

Optical Systems do not only contain optical components and mechanical mounts, but also electronics components to drive active elements, thermo-electrical...