Optical Systems do not only contain optical components and mechanical mounts, but also electronics components to drive active elements, thermo-electrical components for temperature control, actuators to induce motions and many more. A clever integration of all these besides the main optical functionality not only determine the stability and accuracy of the optical performance, but it also influences efficiency and the cost structure of complex optoelectromechanical systems.
At Fraunhofer IOF integration approaches are developed that are based on multifunctional system platforms made of ceramics or glass ceramics. These provide at first a very stable base for the mounting of optical components. Due to various available mechanical structuring methods the platforms also contain mounting geometries in which optical components can precisely be assembled. Thick and thin film structuring allows for wiring and electrical component integration, in case of LTCC ceramics also by using multilayer technologies. Active and passive thermal elements such as fluidic channels or locally good heat conducting geometries are also part of the portfolio.
The assembly of optical systems integrated that way can be carried out at least partially on wafer level. Therefore pick&place technologies can be adapted, thus merging manufacturing of optics and electronics further.