Ultrasonic precision machining of brittle materials

Objective

Machining small structures in glass, ceramics, silicon, composite materials and refractory metals with CNC-Technology.

Technology

• ULTRASONIC assisted grinding with specially coated tools
• Integration of ULTRASONIC spindle in a standard CNC-milling machine.

Characteristics

• Spindle rotational speed 0 - 42 000 rpm
• Maximum workpiece dimension: 350 mm x 240 mm x 340 mm
• Minimum tool diameter 0,4 mm
• Working tolerance: < 10 µm
• Control system Siemens 840D

Competence

• Fabrication of holes, special milling contures and free form surfaces in brittle materials.
• Quartzglass, BK7, Borofloatglass
• Ceran, Zerodur
• Aluminium oxide
• Sintered caramics
• Zircon oxide
• Silicon

Applications

• Cooling structures in silicon wafers
• Dosing coils in glass
• Support components of glass materials
• Mechanical bedstops for optical components
• Aperture holes in optical components
• Holes in composite ceramics
• Free form surface in glass