Ultrasonic precision machining of brittle materials

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Objective

Machining small structures in glass, ceramics, silicon, composite materials and refractory metals with CNC-Technology.

 

Technology

  • ULTRASONIC assisted grinding with specially coated tools
  • Integration of ULTRASONIC spindle in a standard CNC-milling machine.

 

Characteristics

  • Spindle rotational speed 0 - 42 000 rpm
  • Maximum workpiece dimension: 350 mm x 240 mm x 340 mm
  • Minimum tool diameter 0,4 mm
  • Working tolerance: < 10 µm
  • Control system Siemens 840D

 

Competence

  • Fabrication of holes, special milling contures and free form surfaces in brittle materials.
  • Quartzglass, BK7, Borofloatglass
  • Ceran, Zerodur
  • Aluminium oxide
  • Sintered caramics
  • Zircon oxide
  • Silicon

 

Applications

  • Cooling structures in silicon wafers
  • Dosing coils in glass
  • Support components of glass materials
  • Mechanical bedstops for optical components
  • Aperture holes in optical components
  • Holes in composite ceramics
  • Free form surface in glass