Quantum Photonics 2025 | May 13 to 14, 2025
Quantum Photonics 2025 | May 13 to 14, 2025
The Fraunhofer Institute for Applied Optics and Precision Engineering IOF is doing pioneering work in applied research on quantum photonics for scientific and industrial applications. From May 13 to 14, 2025, the institute will present its applied research at the first Quantum Photonics 2025, a congress and trade fair focusing on quantum technologies and photonics.
The QuNET project – an initiative of the German Federal Ministry of Research, Technology and Space (BMFTR; formerly German Federal Ministry of Education and Research (BMBF)) to research highly secure quantum communication for public authorities and critical infrastructure – will also present its latest research findings and technologies at the fair.
Discover the latest quantum research at the Messe Erfurt, Hall 2, booth 2-710. We look forward to seeing you there.
Learn more about our highlight exhibits, presentations, and expert discussions on this page.
At Fraunhofer IOF, within the research project "Advanced quantum computing with trapped ions" (AQTION), a laser-optical setup was realized that allows to manipulate ions in the ion trap of a quantum computer. In a quantum computer, which uses the so-called "ion QuBits" as memory units, the ions are held in electromagnetic traps and can be controlled by means of laser beams thanks to the addressing optics of Fraunhofer IOF.
At our booth, we will be showcasing a fiber-to-chip coupling with 12 polarization-maintaining fibers, which are connected to a waveguide chip by means of an optically adapted adhesive. The fibers were actively aligned and integrated according to their optical power and polarization. The fiber-to-chip coupling is UV-capable at 390 nm and transmits circular mode profiles with ellipticities >0.99.
A very compact optical multiplexer has been developed for a source that generates indistinguishable, polarization-encrypted photons for quantum key distribution. It contains a photonic chip that forms the central signal combiner in the source and is actively thermally controlled using temperature probes and thermoelectric elements. The optical input is provided via lithographic microlenses that couple the light into the waveguide channels, while the output is provided via a coupled fiber.
Fraunhofer IOF is developing a range of entangled photon pair sources for various application scenarios with record-breaking parameters. Such connected or “entangled” photon pairs are to be used in secure encryption technologies (such as quantum key distribution, or QKD) in the future.
In the photon source shown here, a nonlinear, periodically polarized crystal is pumped from two sides in a Sagnac interferometer arrangement. The resulting spontaneous parametric down conversion (SPDC) in the crystal generates polarization-entangled photons in the transmitter and receiver channels. The source is continuously being developed and is one of the most powerful hardware solutions in quantum communication.
Here we present a technical example of a compact and high-performance source of entangled photons. It can be operated with millions of photon pairs per second and per milliwatt of laser pump power, while its broadband light spectrum enables multiplexing capabilities. The source architecture with double beam offset has been tested for entanglement distribution in quantum cryptographic applications across inter-city fiber optic networks in Germany for applications in quantum cryptography.
This entangled photon source (EPS) is a robust and compact system designed for secure quantum communication in space applications. Utilizing a Sagnac loop interferometer, the source is encapsulated within 180 mm x 85 mm x 42 mm, occupying less than one standard unit. This miniature yet effective system is designed for low earth orbit Cubesat and ensures resilience in challenging space environments.
We will present a model of a compact, 15 cm x 15 cm optomechanical prototype of an entangled photon pair source (EPS) with double beam offset. This EPS is being developed for LEO, a low Earth orbit, and includes, among other things, polarization adjustment of the pump beam and an output collimator to redistribute the entangled photons. The current prototype is to undergo vibration and TEVAC testing as part of the EU-funded QUDICE project, which is part of the space qualification tests.
Model of the Jena optical ground station (OGS) for laser and quantum communication with satellites. The ground station, which is currently being installed, will have a mirror telescope with a diameter of 80 cm, optimized for 810 nm and 1550 nm (low losses, polarization-maintaining). Follow-up optics can be mounted on two Nasmyth ports on the telescope axes or set up in the Coudé laboratory under the telescope.
Compact Mid-Infrared light source for the Fast Ghost project. A 40 mm long nonlinear PPLN crystal is pumped by a 405 nm CW laser. The pump beam is coupled via a single-mode fiber and collimated to propagate through the crystal. A pair of photons is generated via spontaneous down conversion (SPDC), with one photon in the MIR spectral range (3.4–4 um) and the second visible photon in the visible section (450–460 nm). After appropriate manipulation (filtering) of the photons, the MIR and VIS photons are fiber-coupled to implement various imaging schemes, such as quantum ghost imaging, where the imaging performance shows an improvement in the signal-to-noise ratio compared to classical implementations. This improvement is due to the temporal correlations between the photon pairs, which enable a lower noise level by setting the time window for detection very narrowly.
The lithium niobate waveguide chip with Mach-Zehnder interferometer, including optical and electrical packaging, forms the centrepiece of a photonic quantum computer. The waveguide chip was developed within the PhoQuant project.
Fraunhofer IOF presents a 4-inch (100 mm) wafer, featuring integrated photonic building blocks based on 400 nm low-loss silicon nitride (SiN). Recognized for its wide transparency window, high power handling, and CMOS compatibility, SiN is a vital material in modern integrated photonics. This wafer includes essential passive components such as waveguides, grating couplers, directional couplers, MMIs, ring resonators, MZIs, and mode converters, supporting a broad spectrum of applications from quantum optics to telecom and sensing.
Manufactured in the clean room of the institute using CMOS-compatible processes, the wafer ensures consistent SiN film quality and low propagation loss. Its layout is optimized for device testing and prototyping of photonic integrated circuits (PICs), offering a scalable platform for research and industrial development. Successful tests on the 4-inch wafer can be seamlessly scaled to 12-inch wafers within the Fraunhofer IOF facilities, providing a pathway for larger-scale production and development.
Fraunhofer IOF provides foundry services focused on hybrid materials integration, enabling precise and efficient development of photonic technologies. Collaborate with us to leverage our expertise and facilities for your next innovation.
The Fraunhofer IOF Process Development Kit (PDK) is an indispensable tool for the development of photonic integrated circuits on the SiN 400 nm platform. It provides a detailed and structured overview of the available components essential for designing modern and efficient circuits.
The PDK includes comprehensive specifications, layout previews, and performance data for a variety of components, including waveguides, couplers, interferometers, and microring resonators. This information is crucial for the precise planning and implementation of design projects. Additionally, the document offers clear design rules to ensure that your projects meet the highest standards. Information on the process stack and meaningful test results support you in making informed decisions and maximizing the performance of your designs.
The Fraunhofer IOF PDK is a valuable resource for professionals working in photonics who wish to develop innovative solutions. It serves as a practical reference and assists you in the successful execution of your design projects. Leverage the capabilities of the Fraunhofer IOF PDK to help shape the future of photonics.
Together with partners from industry and business, Fraunhofer IOF is developing the physical and technical foundations of quantum communication systems and optical link technologies for use in real infrastructure as part of the QuNET initiative – specifically targeting applications in high-security networks. Here, the institute presents a Breadboard of a minaturized metal telescope as part of the transmitter and receiver system for free-space optical links for QKD. The metal-optical telescope made from an aluminum-silicon material is based on a four-mirror design with an aperture of 100 mm. It combines a topology-optimized, additively manufactured housing structure with an active tip-tilt mirror and five additional optical functional surfaces on two substrates. The manufacturing of multiple optical functional surfaces on a single substrate is made possible by ultra-precise diamond machining as a freeform surface. Further process steps such as coating and polishing produce the final high-performance optics for the telescope.
Opening speech of the 1st edition of Quantum Photonics, moderated by the Director of the Fraunhofer IOF, Prof. Dr. Tünnermann, State Secretary Mario Suckert and the CEO of Messe Erfurt, Michael Kynast.
Date: May 13, 2025
Time: 10:00 a.m. to 10:30 a.m.
Where: Hall 2
Speaker: Dr. Sebastian W. Schmitt
The integration of quantum optical components on chips enables ultra-secure communication, precise sensing, and faster AI. Fraunhofer IOF develops innovative solutions for scalable, CMOS-compatible technologies.
Integrating quantum optical building blocks at the chip level paves the way for bringing the benefits of quantum optics to the consumer market, enabling advancements such as ultra-secure communication, high-precision sensing, faster AI processing, and next-generation medical diagnostics in everyday applications. With the quantum technology market projected to reach billions in value over the coming years, scalable on-chip solutions will be key to driving widespread adoption and commercialization.
However, integrating quantum optical components at this scale presents significant challenges in material selection and fabrication, requiring high-purity materials, precise nanofabrication techniques, and seamless integration with existing semiconductor technologies to maintain quantum coherence and efficiency. PIC activities at Fraunhofer IOF strategically address these challenges, beginning with precise calculations of waveguide coupled mode dynamics, followed by component development and layout design, and culminating in high-precision fabrication within a 300 nm cleanroom environment.
The talk will explore solution approaches for enabling the preparation and modulation of quantum states of light through advancements in modern materials science and nanotechnology. Specifically, we will focus on devices for the generation and modulation of signal and idler photons with different frequencies and polarizations within CMOS-compatible platform technologies such as Silicon Nitride (Si3N4), Lithium Niobate (LiNbO3) and Barium Titanate (BaTiO₃).
Quantum imaging protocols have been emerging in the last decades as powerful tools to move beyond the limitations imposed by classical optics on existing imaging systems, and unlock quantum-enhanced capabilities, in terms of resolution, enhanced signal-to-noise ratio, lowlight illumination-enabled reduced phototoxicity, and the possibility to exploit quantum frequency correlations to perform imaging in wavelength ranges where detection technology is underdeveloped using standard CMOS silicon camera technology. Focusing on the last of the above-mentioned four directions to pursue a “quantum advantage” in imaging systems, we present our latest progress in “two-color” quantum imaging schemes, based on frequency
correlations of photon-pairs generated through Spontaneous Parametric Down-conversion (SPDC), to access the mid-infrared spectral region with enhanced detection efficiency for biomedical applications. We further discuss technical implementation bottlenecks through Quantum Imaging with Undetected Light (QIUL) and discuss feasibility and scalability towards
market uptake.
Photonic packaging is a key technology for building capable quantum systems beyond their laboratory stages. This talk explores how we utilize different packaging technologies, including active fiber coupling and microlens array alignment, to develop integrated photonic systems, such as addressing units for ion quantum computing and optical multiplexers for quantum communication.
Come and talk to our researchers. During the periods listed below, you will have the opportunity to discuss specialist topics directly with experts from Fraunhofer IOF at our booth 2-710, Hall 2. Feel free to contact our colleagues in advance to arrange an appointment.
Dr. Erik Beckert – Hybrid system integration of complex opto-mechatronic components
Tuesday, May 13, from 10 a.m. to 11 a.m.
Michael Reibe – Photonic packaging
Tuesday, May 13, from 2 p.m. to 3 p.m.
Marcus Babin – Laser addressing units for quantum computers
Wednesday, May 14, from 2 p.m. to 3 p.m.