UV molding is a cost-effective process for manufacturing micro-optics on a wafer scale. For this purpose, liquid polymer resin is cured in a contact mask aligner between a substrate (e.g. glass or semiconductor wafer) and a transparent molding tool using ultraviolett light.
The process is established in applications where the precision or stability of all-polymer optics is not sufficient and high-precision alignment of several layers is required, e.g. double-sided microlens array, reflow-solderable optical units. Particular, large-area display and wafer-level optics applications on substrates up to Ø 300 mm are addressed. The short cycle time of UV curing is beneficial compared to thermal curing processes.