Processing of large-scale substrates in the LED based microlithography tool

Micro- and Nanostructure Technology and Microoptics Technology

Micro- and nanostructure technology

  • Photolithography
  • Electron Beam Lithography System SB350ƒOS
  • 300ƒmm writing capability
  • Minimum feature size < 65 ƒnm
  • Address grid 1ƒ nm
  • Placement accuracy < 15 nm
  • Advanced multilevel technology
  • Efficient data processing capability
  • Dynamic LED-based grayscale lithography system "High Five"
  • Lithography system specially designed for generation of micro optical elements
  • High dynamic dosage control at 405 nm exposure wavelength
  • Small feature sizes down to 0.5 µm
  • Maximum writing field size: 0.5 × 0.5 m2

Microoptics technology

  • Planarization / ion beam figuring of substrates
  • Resist technology for 12” substrates
  • Reactive ion etching
  • Silicon, fused silica, high index materials
  • Etching aspect ratio < 1:10
  • Coating
  • HR, AR, metals
  • Sputtering, evaporation, ALD
  • Wafer dicing and ultra precision machining
  • UV-moulding
  • Hot embossing facility
  • Mask-aligner
  • Nano imprint and wafer scale replication