Fraunhofer Institute for Applied Optics and Precision Engineering IOF
Fraunhofer Institute for Applied Optics and Precision Engineering IOF

Processing of large-scale substrates in the LED based microlithography tool

Micro- and Nanostructured Optics - Technology Chain

Lithography Technology

Photolithography

  • Dynamic LED-based grayscale lithography system "High Five"
  • Lithography system specially designed for generation of micro optical elements
  • High dynamic dosage control at 405 nm exposure wavelength
  • Small feature sizes down to 0.5 µm
  • Maximum writing field size: 0.5 × 0.5 m2

 

Electron Beam Lithography System SB350 OS

  • Minimum feature size < 65 nm
  • Address grid 1 nm
  • Placement accuracy < 15 nm
  • Advanced multilevel technology

Microoptics technology

  • Planarization / ion beam figuring of substrates
  • Resist technology for 12” substrates
  • Reactive ion etching
  • Silicon, fused silica, high index materials
  • Etching aspect ratio < 1:10
  • UV-moulding
  • Hot embossing facility
  • Mask-aligner
  • Nano imprint and wafer scale replication

Characterization of Large Substrates

  • Scanning electron microscope with focused long-beam tool and material analysis (EDX, EBSD)
  • AFM: for substrates up to 12" Substrat
  • 12" plane-wave interferometer
  • 11" reference mirror, WFE < 4 nm rms
  • Interferometric surface profilometer
  • Measurement of diffraction efficiencies of gratings
  • Ellipsometer for layer stack characterization